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存儲卡介面: e・MMC

e-MMC 是 NAND 快閃記憶體系列產品,具備 ECC、平均抹寫與故障區塊管理等控制功能。

e-MMC 也提供與 JEDEC 5.0/5.1 版相容的高速記憶卡介面,讓使用者不再需要考慮直接控制 NAND 快閃記憶體的相關事宜。因此,e-MMC 可輕易地做為嵌入式應用的儲存裝置使用。

Capacity Part Number Class e-MMC Version Max Data Rate
(MB/s)
Supply Voltage Operating
Temperature (°C)
Package
Vcc (V) VccQ (V) Size (mm) Code
4 Gbytes THGBMNG5D1LBAIT Consumer 5.0 400 2.7 to 3.6 1.70 to 1.95,
2.7 to 3.6
-25 to 85 11×10×0.8 P-WFBGA153-1110-0.50
THGBMNG5D1LBAIL Consumer 5.0 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -25 to 85 11.5×13×0.8 P-WFBGA153-1113-0.50
8 Gbytes THGBMHG6C1LBAIL Consumer 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -25 to 85 11.5×13×0.8 P-WFBGA153-1113-0.50
THGBMHG6C1LBAU6 Industrial 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -40 to 105 (1) 11.5×13×0.8 P-WFBGA153-1113-0.50
16 Gbytes THGBMHG7C1LBAIL Consumer 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -25 to 85 11.5×13×0.8 P-WFBGA153-1113-0.50
THGBMHG7C2LBAU7 Industrial 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -40 to 105 (1) 11.5×13×1.0 P-VFBGA153-1113-0.50
32 Gbytes THGBMHG8C2LBAIL Consumer 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -25 to 85 11.5×13×0.8 P-WFBGA153-1113-0.50
THGBMHG8C4LBAU7 Industrial 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -40 to 105 (1) 11.5×13×1.0 P-VFBGA153-1113-0.50
64 Gbytes THGBMHG9C4LBAIR Consumer 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -25 to 85 11.5×13×1.0 P-VFBGA153-1113-0.50
THGBMHG9C8LBAU8 Industrial 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -40 to 105 (1) 11.5×13×1.2 P-TFBGA153-1113-0.50
128 Gbytes THGBMHT0C8LBAIG Consumer 5.1 400 2.7 to 3.6 1.70 to 1.95, 2.7 to 3.6 -25 to 85 11.5×13×1.2 P-TFBGA153-1113-0.50
  • Note (1): Tc=115°C max.
  • Contact the Toshiba sales representative for sample schedule about products under development.
  • Details about your intended usage would be checked before submitting samples of the Industrial class product.

相關鏈結

MLC NAND
  • 存儲卡介面: e・MMC™
  • UFS

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.