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SLC NAND闪存

Our SLC NAND flash memory supports customers' business  with an extensive product lineup.

For a wide application

To meet needs of diverse customers' application, our SLC NAND flash memory products offer wide line-up of capacity and package type. SLC NAND is adopted in a wide range of applications from consumer use to industrial use because of its high Read and Write speed and high reliability. Moreover, compared to NOR type flash memory, significant cost merit can be achieved.

Toshiba Memory has pioneered flash memory as the industry leader and has proactively applied advanced processes. In addition, BENAND™ with built-in ECC in SLC NAND and Serial Interface NAND with interface of Serial Peripheral Interface compatible with SLC NAND are available, so customers can select a suitable SLC NAND device according to the error correction capability and memory interface of host controller.

*SLC:单层单元
*BENAND™:内置ECC NAND
*All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

SLC NAND闪存产品阵容

- SLC NAND products consist of three categories.
- Customers can select a suitable SLC NAND device according to the error correction capability and memory interface of host controller.

SLC NAND is adopted in a wide range of applications from consumer use to industrial use because of its high Read and Write speed and high reliability.

SLC NAND Block Diagram

BENAND™(Built-in ECC NAND) is a SLC NAND memory device which has an Internal Hardware ECC Engine.
Using BENAND it is possible for customers to use the latest 24nm SLC NAND flash memory technology even when their platform cannot support higher bit ECC.

BENAND Block Diagram

Serial Interface NAND is a SLC NAND memory device with Serial Peripheral Interface (SPI).
SPI is one of the most common interfaces in SoC today and is offered in small package size (WSON,SOP(*),BGA(**)).

Serial Interface NAND Block Diagram
*串行接口NAND中的ECC逻辑电路由客户自行启用和禁用。

* Please check the latest MP status with TMC sales representative regarding SOP package
** BGA package is under planning
Product List

SLC NAND列表
您可以根据特征搜索整个SLC NAND列表。

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant Toshiba Memory information and the instructions for the application that Product will be used with or for.