Contact us

Откроется новое окно Откроется новое окно

Client SSD

BG3 Series

BG3 Series Click to enlarge

The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.

BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.

The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.

Key Features
  • Toshiba 64-Layer BiCS FLASH™
  • PCIe® Gen3*2L NVMe™
  • Capacities up to 512GB
  • M.2 1620 single package and M.2 2230 single-sided form factor
  • TCG OPAL 2.01 Optional for SED
Documents
Applications
  • Ultra-mobile PCs
  • 2-in-1 notebook PCs
  • IoT/embedded devices
  • Server and storage array boot drives

Specifications

  M.2 1620-S3
Single Package
M.2 1620-S2
Single Package
M.2 2230-S3
Single-sided Module
M.2 2230-S2
Single-sided Module
Photograph photo of M.2 1620 single package photo of M.2 2230 single-sided form factor
Basic Specifications
Model Number (Non-SED) KBG30ZPZ512G KBG30ZPZ256G KBG30ZPZ128G KBG30ZMS512G KBG30ZMS256G KBG30ZMS128G
(SED) KBG3AZPZ512G KBG3AZPZ256G KBG3AZPZ128G KBG3AZMS512G KBG3AZMS256G KBG3AZMS128G
Formatted Capacity 512 GB 256 GB 128 GB 512 GB 256 GB 128 GB
Connector Type - M.2 B-M
Interface PCI Express Base Specification Revision 3.1a
(NVM Express™ Revision 1.2.1 command set)
Maximum Interface Speed 16 GT/s
(PCIe Gen3x2 Lane)
Flash Memory Type TLC (BiCS Flash™)
Sequential Read
(Up to)
(Non-SED) 1,500 MB/s
{1,430 MiB/s}
1,400 MB/s
{1,330 MiB/s}
1,300 MB/s
{1,240 MiB/s}
1,500 MB/s
{1,430 MiB/s}
1,400 MB/s
{1,330 MiB/s}
1,300 MB/s
{1,240 MiB/s}
(SED) 1,300 MB/s
{1,240 MiB/s}
1,250 MB/s
{1,190 MiB/s}
1,200 MB/s
{1,140 MiB/s}
1,300 MB/s
{1,240 MiB/s}
1,250 MB/s
{1,190 MiB/s}
1,200 MB/s
{1,140 MiB/s}
Sequential Write
(Up to)
(Non-SED) 1,000 MB/s
{950 MiB/s}
800 MB/s
{760 MiB/s}
600 MB/s
{570 MiB/s}
1,000 MB/s
{950 MiB/s}
800 MB/s
{760 MiB/s}
600 MB/s
{570 MiB/s}
(SED) 950 MB/s
{900 MiB/s}
750 MB/s
{710 MiB/s}
550 MB/s
{520 MiB/s}
950 MB/s
{900 MiB/s}
750 MB/s
{710 MiB/s}
550 MB/s
{520 MiB/s}
Reliability
MTTF 1,500,000 hours
Power Requirements
Supply Voltage 3.3 V ±5 %
1.8 V ±5 %
1.2 V ±5 %
3.3 V ±5 %
Power consumption (Active) 2.8 W typ. 2.7 W typ. 3.3 W typ. 3.2 W typ.
Power consumption (L1.2 mode) 5 mW max. 5 mW max.
Dimensions
Height 1.5 mm 1.3 mm 2.38 mm 2.18 mm
Width 16.0 mm 22.0 mm
Length 20.0 mm 30.0 mm
Weight 1.00 g typ. 0.85 g typ. 2.60 g typ. 2.42 g typ.
Environmental
Temperature (Operating) 0 ~ 80 °C (Package Temperature) 0 ~ 80 °C (Components Temperature)
Temperature (Non-operating) -40 ~ 85 °C
Vibration
(Operating/Non-operating)
- 196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock
(Operating/Non-operating)
- 14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features
  • Device Self-test is supported.
  • Host Controlled Thermal Management (HCTM) is supported.
  • The feature of Host Memory Buffer (HMB) is supported.
  • Firmware security feature (only digitally signed firmware can be installed) is supported.
  • For additional information, please refer to BG3 Series Product Manual.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes.  A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity.  Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content.  Actual formatted capacity may vary.
  • A kibibyte (KiB) means 210, or 1,024 bytes, a mebibyte (MiB) means 220, or 1,048,576 bytes, and a gibibyte (GiB) means 230, or 1,073,741,824 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation.  Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • PCIe and PCI Express are registered trademarks of PCI-SIG.
  • NVMe™ and NVM Express™ are trademarks of NVM Express, Inc.
  • All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

Контакты

Если у вас возникли вопросы, перейдите по одной из этих ссылок:

Запрос на предоставление технической информации
Вопросы о покупке, образцах и надежности интегральных схем
To Top
·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.