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Client SSD

XG6 Series

XG6 Series Click to enlarge

The XG6 series utilizes Toshiba Memory's latest 96-layer, 3D TLC (3-bit-per-cell) flash memory. With 4th generation BiCS FLASH™ and SLC cache features, XG6 SSDs reach up to sequential read/write speeds of 3180 MB/s and 2960 MB/s respectively and deliver up to 355,000 random read and 365,000 random write IOPS. In addition to high performance, XG6 carries on the low power design of the XG family, consuming 4.7 W or less in active mode and less than 3 mW in stand-by mode.
 

The new XG6 series is optimized for power-sensitive mobile PCs, performance-oriented gaming PCs, as well as data center environments for server-boot, caching and logging.
 

Available in a compact M.2 2280 single-sided form factor, the XG6 series comes in three capacity models of 256 GB, 512 GB and 1024 GB, each with the option of a Self-Encrypting Drive (SED) model supporting TCG Opal Version 2.01.

Key Features
  • Toshiba Memory 96-Layer BiCS FLASH™
  • PCIe® Gen3x4L NVMe™
  • Capacitiies up to 1024 GB
  • M.2 2280 Single-sided
  • TCG OPAL 2.01 Optional for SED
Documents
Applications
  • Thin performance notebook PCs
  • High-performance desktop PCs
  • Gaming PCs
  • Server-boot, caching & logging use in data center

Specifications

  M.2 2280-S2
(Single-sided)
Photograph
Basic Specifications
Model Number (Non-SED) KXG60ZNV1T02 KXG60ZNV512G KXG60ZNV256G
(SED) KXG6AZNV1T02 KXG6AZNV512G KXG6AZNV256G
Fomatted Capacity 1,024 GB 512 GB 256 GB
Connector Type M.2 M
Interface PCI Express® Base Specification Revision 3.1a
 (NVM Express™ Revision 1.3a command set)
Maximum Interface Speed 32 GT/s
(PCIe® Gen3X4)
Memory Type TLC (BiCS Flash™)
Sequential Read (Up to) 3,180 MB/s 3,100 MB/s 3,050 MB/s
Sequential Write (Up to) 2,960 MB/s 2,800 MB/s 1,550 MB/s
Reliability
MTTF 1,500,000 hours
Power Requirements
Supply Voltage 3.3 V ±5 %
Power consumption (Active) 4.7 W typ. 4.1 W typ. 4.0 W typ.
Power Consumption (L1.2 mode) 3 mW typ.
Dimensions
Height 2.23 mm
Width 22.0 mm
Length 80.0 mm
Weight 7.3 g typ. 7.0 g typ.
Environmental
Temperature (Operating) 0 to 95 °C
(Controller Temperature)
0 to 85 °C
 ( Other Components Temperature )
Temperature
(Non-operating)
-40 to 85 °C
Vibration
(Operating/Non-operating)
196 m/s2 { 20 G } ( Peak, 10 to 2,000 Hz )
Shock
(Operating/Non-operating)
14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features
  • Sanitize is supported.
  • Namespace Management and Namespace Attachment commands are supported.
  • Non-Operational Power State Configuration is supported.
  • TCG Storage Interface Interactions Specification (SIIS) Version 1.07 is supported.
  • For additional information, please refer to XG6 Series Product Manual.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes.  A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity.  Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content.  Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation.  Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.

*PCI and PCIe EXPRESS are registered trademarks of PCI-SIG.
*NVMe and NVM Express are trademarks of NVM Express, Inc.
*All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.