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Client SSD

XG5-P Series

XG5-P Series Click to enlarge

The premium XG5-P NVMe™ SSD series delivers enhanced performance of up to 3000 MB/s sequential read, 2200 MB/s sequential write, 320,000 random read IOPS and 265,000 random write IOPS while maintaining the low power consumption of the XG5 series.
 

Thanks to in-house developed 64-layer, 3D BiCS FLASH™ memory and 1TB package technology, Toshiba Memory Corporation maintains a single-sided, ultra-thin M.2 2280 form factor for all capacities across the XG5-P and XG5 product families, and offers platforms that need flexible storage dimensional compatibility.
 

The XG5-P series is available in 1TB and 2TB large capacity models for workstation, high-end PCs, as well as read-intensive applications. Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 are also available for additional data security.

Key Features
  • Toshiba 64-Layer BiCS FLASH™
  • PCIe® Gen3*4L NVMe™
  • Capacities up to 2048GB
  • M.2 2280 Single-sided
  • TCG OPAL 2.01 Optional for SED
Documents
Applications
  • Workstation PCs
  • Gaming, Enthusiast PCs
  • Embedded performance driven application
  • Read-intensive enterprise use

Specifications

  M.2 2280-S2
(Single-sided)
Photograph
Basic Specifications
Model Number (Non-SED) KXG50PNV2T04 KXG50PNV1T02
(SED) KXG5APNV2T04 KXG5APNV1T02
Formatted Capacity 2,048 GB 1,024 GB
Connector Type M.2 M
Interface  PCI Express® Base Specification Revision 3.1a
(NVM Express™ Revision 1.2.1 command set)
Maximum Interface Speed 32 GT/s
(PCIe® Gen3x4 Lane)
Memory Type TLC (BiCS Flash™)
Sequential Read
(Up to)
3,000 MB/s
{2,900 MiB/s}
Sequential Write
(Up to)
Up to 2,200 MB/s
{2,100 MiB/s}
Up to 2,100 MB/s
{2,000 MiB/s}
Reliability
MTTF 1,500,000 hours
Power Requirements
Supply Voltage

3.3 V ±5 %

Power Consumption (Active) 4.9 W typ. 4.8 W typ.
Power Consumption (L1.2 mode) 3 mW typ.
Dimensions
Height 2.23 mm
Width 22.0 mm
Length 80.0 mm
Weight 7.3 g typ.
Environmental
Temperature (Operating) 0 to 95 °C
( Controller Temperature )
0 to 85 °C
( Other Components Temperature )
Temperature (Non-operating) -40 to 85 °C
Vibration (Operating/Non-operating) 196 m/s2 { 20 G } ( Peak, 10 to 2,000 Hz )
Shock (Operating/Non-operating) 14.7 km/s2 { 1,500 G } ( 0.5 ms )
More Features Support for:
  • Device Self-test
  • Host Controlled Thermal Management (HCTM)
  • QSBC™: Strong & highly-efficient ECC
  • TCG Pyrite Version 1.00
  • Storage Interface Interactions Specification(SIIS) Version 1.06  
  • For additional information, please refer to XG5-P Series Product Manual.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes.  A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity.  Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content.  Actual formatted capacity may vary.
  • A kibibyte (KiB) means 210, or 1,024 bytes, a mebibyte (MiB) means 220, or 1,048,576 bytes, and a gibibyte (GiB) means 230, or 1,073,741,824 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation.  Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCI Express and PCIe are registered trademarks of PCI-SIG.
  • NVMe and NVM Express are trademarks of NVM Express, Inc.
  • All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.