Contact us

A new window will open A new window will open

Serial Interface NAND

Features of Serial Interface NAND

Host can control the device by a low pin count

Supports Mode 0 and Mode 3 of Serial Peripheral Interface (SPI)

Embedded ECC engine

Provides information of  ECC correction, ECC on Host controller is not required.

The latest 24nm SLC NAND process technology
Offers wide line-up of capacity

For Serial Interface NAND, 1Gbit, 2Gbit and 4Gbit are available in a lineup.

Available in small packages

6 x 8mm WSON, 10.3 x 7.5 SOP(*), 6 x 8 BGA(**)

* Please check the latest MP status with TMC sales representative regarding SOP package
** BGA package is under planning

Serial Interface NAND Block Diagram
* The ECC logic in Serial Interface NAND can be enabled and disabled by the customers.

Product Lineup

Category Density
Serial Interface NAND 1 Gb 2 Gb 4 Gb

*Please click on any item to show detailed product line up and to download datasheet.


If you have any questions, click one of these links:

Technical queries
Questions about purchasing, sampling and IC reliability
Purchase price depends on the sales period and/or quantity, please contact the sales representative.
To Top
·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant Toshiba Memory information and the instructions for the application that Product will be used with or for.