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Client SSD

XG5 Series

XG5 Series Click to enlarge

XG5 series SSDs feature Toshiba’s latest 64-layer, 3D TLC (3-bit-per-cell) flash memory BiCS FLASH™. This new line of NVMe™ based client SSDs deliver high performance up to 3000 MB/s of sequential read and 2100 MB/s of sequential write with a maximum interface bandwidth of 32 GT/s. XG5 series SSDs also feature an SLC cache to accelerate burst type workloads, as well as improved power consumption comparing to prior generation XG3, making these SSDs an efficient option for high performance mobile computing.

XG5 Series SSDs are available in 256GB, 512GB and 1024GB capacities in compact single-sided M.2 2280 form factors.

Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 are also offered, making the new series highly suited to address data security needs for commercial PCs or other business applications.

Key Features
  • Toshiba 64-Layer BiCS FLASH™
  • PCIe® Gen3*4L NVMe™
  • capacities up to 1024GB
  • M.2 2280 Single-sided
  • TCG OPAL 2.01 Optional for SED
Documents
Applications
  • Thin performance Notebook
  • Enthusiast Desktop/Laptop
  • Mainstream PC Computing
  • Server / Storage Boot

Specifications

　 M.2 2280-S2
(Single-sided)
Photograph
Basic Specifications
Model Number (Non-SED) KXG50ZNV1T02 KXG50ZNV512G KXG50ZNV256G
(SED) KXG5AZNV1T02 KXG5AZNV512G KXG5AZNV256G
Formatted Capacity 1,024 GB 512 GB 256 GB
Connector Type M.2 M
Interface　 PCI Express® Base Specification Revision 3.1a
(NVM Express™ Revision 1.2.1 command set)
Maximum Interface Speed 32 GT/s
(PCIe®/ Gen3x4 Lane)
Memory Type TLC (BiCS Flash™)
Sequential Read
(Up to)		 3,000 MB/s
{2,900 MiB/s}		 2,700 MB/s
{2,580 MiB/s}
Sequential Write
(Up to)		 2,100 MB/s {2,000 MiB/s} 1,050 MB/s {1,000 MiB/s}
Reliability
MTTF 1,500,000 hours
Power Requirements
Supply Voltage

3.3 V ±5 %
Power Consumption (Active) 4.5 W typ. 4.3 W typ. 4.0 W typ.
Power Consumption (L1.2 mode) 3 mW typ.
Dimensions
Height 2.23 mm
Width 22.0 mm
Length 80.0 mm
Weight 7.3 g typ. 7.0 g typ.
Environmental
Temperature (Operating) 0 to 95 °C
( Contorller Temperature )
0 to 85 °C
( Other Components Temperature )
Temperature (Non-operating) -40 to 85 °C
Vibration (Operating/Non-operating) 196 m/s2 { 20 G } ( Peak, 10 to 2,000 Hz )
Shock (Operating/Non-operating) 14.7 km/s2 { 1,500 G } ( 0.5 ms )
More Features
  • Device Self-test is supported.
  • Host Controlled Thermal Management (HCTM) is supported.
  • Strong & highly-efficient ECC named QSBCTM is supported.
  • TCG Pyrite Version 1.00 is supported.
  • Storage Interface Interactions Specification(SIIS) Version 1.06 is supported.
  • For additional information, please refer to XG5 Series Product Brief.
  • Product image may represent a design model.
  • Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes.  A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity.  Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content.  Actual formatted capacity may vary.
  • A kibibyte (KiB) means 210, or 1,024 bytes, a mebibyte (MiB) means 220, or 1,048,576 bytes, and a gibibyte (GiB) means 230, or 1,073,741,824 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation.  Actual operating life of the product may be different from the MTTF.
  • Read and write speed may vary depending on the host device, read and write conditions, and file size.
  • PCI EXPRESS and PCIe are registered trademarks of PCI-SIG.
  • NVMe and NVM Express are trademarks of NVM Express, Inc.
  • All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

Contacts

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.
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